| Document Type
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BL
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| Record Number
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1033397
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| Doc. No
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b787767
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| Main Entry
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Wasa, Kiyotaka.
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| Title & Author
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Handbook of sputter deposition technology : : principles, technology, and applications /\ by Kiyotaka Wasa and Shigeru Hayakawa.
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| Publication Statement
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Park Ridge, N.J., U.S.A. :: Noyes Publications,, ©1992.
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| Series Statement
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Materials science and process technology series
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| Page. NO
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xii, 304 pages :: illustrations ;; 24 cm.
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| ISBN
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0815512805
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: 9780815512806
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| Bibliographies/Indexes
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Includes bibliographical references and index.
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| Abstract
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A concise, comprehensive overview of sputter deposition technologyua key technology for materials research in the next decade. Cathode sputtering is widely used in the microelectronics industry for silicon integrated circuit production and for metallurgical coatings. High temperature superconductors can be synthesized with sputtering under non-equilibrium conditions. Diamond films and ferroelectric materials are other applications.
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| Subject
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Cathode sputtering (Plating process)
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Thin films.
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| Subject
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Beschichten
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Cathode sputtering (Plating process)
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Cathode sputtering (Plating process)
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Couches minces métalliques.
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Couches minces.
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Dünnschichttechnik
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Materiais e dispositivos semicondutores.
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| Subject
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Pulvérisation cathodique.
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| Subject
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Sputtern
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| Subject
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Thin films.
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| Dewey Classification
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621.3815/2
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| LC Classification
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TS695.W37 1992
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| NLM classification
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33.68bcl
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52.78bcl
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537.525
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UP 7550rvk
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ZM 7620rvk
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| Added Entry
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Hayakawa, Shigeru,1925-
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