| Document Type
|
:
|
BL
|
| Record Number
|
:
|
1043532
|
| Doc. No
|
:
|
b797902
|
| Main Entry
|
:
|
Tsividis, Yannis.
|
| Title & Author
|
:
|
Mixed analog-digital VLSI devices and technology /\ Yannis Tsividis.
|
| Publication Statement
|
:
|
Singapore ;River Edge, N.J. :: World Scientific,, ©2002.
|
| Page. NO
|
:
|
1 online resource (x, 284 pages) :: illustrations
|
| ISBN
|
:
|
9789812381118
|
|
|
:
|
: 9789812703842
|
|
|
:
|
: 9812381112
|
|
|
:
|
: 9812703845
|
|
|
:
|
9812381112
|
| Bibliographies/Indexes
|
:
|
Includes bibliographical references and index.
|
| Contents
|
:
|
Preface; Chapter 1. Introduction: Mixed Analog-Digital Chips; 1.1 The Role and Place of Modern Mixed Analog-Digital Chips; 1.2 Advantages of Mixing Analog and Digital Circuits on the Same Chip; 1.3 Applications of MAD Chips; 1.4 Obstacles in the Design of MAD Chips; 1.5 The Aim and Contents of This Book; Chapter 2. The MOSFET: Introduction and Qualitative View; 2.1 Introduction; 2.2 MOS Transistor Structure; 2.3 Assumptions about Terminal Voltages Currents and Temperature; 2.4 A Qualitative Description of MOSFET Operation; 2.4.1 Effect of VGS: Level of Inversion.
|
|
|
:
|
2.4.2 Effect of VSB: The Body Effect2.4.3 Effect of VDS: Drain Current; 2.5 A Fluid Dynamical Analog; 2.6 Complete Set of Characteristics; 2.7 Form of Functional lD-VGS Dependence: Practical Limits for Regions of Inversion; 2.8 Factors Affecting the Extrapolated Threshold Voltage; 2.9 Other Factors Affecting the Drain Current; Chapter 3. MOSFET DC Modeling; 3.1 Introduction; 3.2 DC Model for Weak and for Strong Inversion; 3.2.1 The Current Equations; 3.2.2 Model Parameters Influenced by the Body Effect; 3.2.3 Origin and Validity of the Model; 3.3 Drain versus Source; 3.4 Symmetric Models.
|
|
|
:
|
3.5 General Models and Moderate Inversion3.6 Mobility Dependence on Gate and Substrate Bias; 3.7 Temperature Effects; 3.8 Small-Dimension Effects; 3.9 Breakdown; 3.10 The pMOS Transistor; 3.11 Device Symbols; 3.12 Model Accuracy Parameter Extraction and Computer Simulation; Chapter 4. MOSFET Small-Signal Modeling; 4.1 Introduction; 4.2 Small-Signal Conductance Parameters; 4.3 Expressions for Small-Signal Conductance Parameters in Weak and in Strong Inversion; 4.3.1 Gate Transconductance; 4.3.2 Body Transconductance; 4.3.3 Drain-Source Conductance; 4.3.4 Drain-Substrate Conductance.
|
|
|
:
|
4.3.5 Examples4.3.6 Small-Signal Parameters in the Presence of Second-Order Effects; 4.4 Capacitance Parameters; 4.4.1 Extrinsic Capacitances; 4.4.2 Intrinsic Capacitances in Weak and in Strong Inversion; 4.5 Intrinsic Cutoff Frequency and Limits of Model Validity; 4.6 The Transistor at Very High Frequencies; 4.6.1 Extrinsic Parasitic Resistances; 4.6.2 Intrinsic Nonquasi-static Effects; 4.7 Noise; 4.7.1 Introductory Remarks; 4.7.2 MOS Transistor Noise; 4.8 General Models and Moderate Inversion; 4.9 Parameter Extraction for Accurate Small-Signal Modeling; 4.10 Requirements for Good CAD Models.
|
|
|
:
|
Chapter 5. Technology and Available Circuit Components5.1 Introduction; 5.2 The n-Well CMOS Process; 5.2.1 Basic Fabrication Steps and MOS Transistor Structures; 5.2.2 Capacitors; 5.2.3 Resistors; 5.2.4 Inductors; 5.2.5 Bipolar Transistors; 5.2.6 Interconnects; 5.2.7 Electrical Parameters; 5.2.8 Input Protection; 5.2.9 Latch-up; 5.3 BiCMOS Processes; 5.3.1 Adding High-Performance Bipolar Transistors to CMOS; 5.3.2 Bipolar Transistor Models; 5.4 Other Silicon Processes; 5.5 Sensors; 5.6 Trimming; 5.7 Tolerance and Matching of Electrical Parameters; 5.8 Chip Size and Yield.
|
| Abstract
|
:
|
Improve your circuit-design potential with this expert guide to the devices and technology used in mixed analog-digital VLSI chips for such high-volume applications as hard-disk drives, wireless telephones, and consumer electronics. The book provides you with a critical understanding of device models, fabrication technology, and layout as they apply to mixed analog-digital circuits. You will learn about the many device-modeling requirements for analog work, as well as the pitfalls in models used today for computer simulators such as Spice. Also included is information on fabrication technologi.
|
| Subject
|
:
|
Integrated circuits-- Very large scale integration-- Design and construction.
|
| Subject
|
:
|
Integrated circuits-- Very large scale integration-- Mathematical models.
|
| Subject
|
:
|
Mixed signal circuits.
|
| Subject
|
:
|
Integrated circuits-- Very large scale integration-- Design and construction.
|
| Subject
|
:
|
Integrated circuits-- Very large scale integration-- Mathematical models.
|
| Subject
|
:
|
Mixed signal circuits.
|
| Dewey Classification
|
:
|
621.39/5
|
| LC Classification
|
:
|
TK7874.75.T78 2002eb
|