Evaluation and improvement of the robustness of a PCB pad in a lead-free environment

مرکز و کتابخانه مطالعات اسلامی به زبان های اروپایی

منو

" Evaluation and improvement of the robustness of a PCB pad in a lead-free environment "
Jing Li K. Srihari

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	52370
Doc. No	:	TL22324
Call number	:	‭3288934‬
Main Entry	:	Jing Li
Title & Author	:	Evaluation and improvement of the robustness of a PCB pad in a lead-free environment\ Jing Li
College	:	State University of New York at Binghamton
Date	:	2007
Degree	:	Ed.D.
student score	:	2007
Page No	:	136
Abstract	:	The lead-free requirement in electronics has significantly impacted second-level interconnection reliability due to modification of the solder alloy, laminate material and related assembly processes. Pad cratering, which refers to the fracturing of the resin under the connecting Copper (Cu) pads, has caused a concern in the reliability sub-domain. Pad cratering is primarily caused by mechanical stresses or overload conditions, which can be induced by impact loads, such as accidental drops or large amplitude bends. The separation of the connecting pad from the circuit board leads to electrical failure and other issues that drastically decrease the interconnection reliability. The objective of this research endeavor was to develop standardized characterization methods for evaluating the robustness of pads and subsequent knowledge of the effects which can degrade pad robustness using a cause-effect analysis strategy.
Subject	:	Applied sciences; Interconnects; Lead-free; Pad cratering; Printed circuit board; Packaging; Systems design; 0790:Systems design; 0549:Packaging
Added Entry	:	K. Srihari
Added Entry	:	State University of New York at Binghamton