خط مشی دسترسیدرباره ماپشتیبانی آنلاین
ثبت نامثبت نام
راهنماراهنما
فارسی
ورودورود
صفحه اصلیصفحه اصلی
جستجوی مدارک
تمام متن
منابع دیجیتالی
رکورد قبلیرکورد بعدی
Document Type:Latin Dissertation
Language of Document:English
Record Number:53370
Doc. No:TL23324
Call number:‭1447254‬
Main Entry:Siu Lung Ng
Title & Author:Effect of thermal and mechanical factors on single and multi-chip BGA packagesSiu Lung Ng
College:State University of New York at Binghamton
Date:2007
Degree:M.S.
student score:2007
Page No:128
Abstract:The domain of electronics undergoes continuous development to meet consumer demands while keeping up with "Moore's law". One of the approaches to meet these requirements is the use of multiple die in a single packaging module with a thinner package thickness. This research is a comparative study that evaluates the thermo-mechanical stresses developed in the single die, multi-chip and stack die packages. In this research, warpage measurement and bend tests were used to quantify the effects of stresses induced in these packages. The warpage displacement analysis showed package two die side by side with thicker mold compound thickness had the least amount of out of plane displacement compared to other package designs. In the cyclic four point bend test, all package recorded life were long enough to not affect functionality in field. However, solder cycles to failure did decrease in a side by side package due to increased package stiffness.
Subject:Applied sciences; Packaging; 0549:Packaging
Added Entry:K. Srihari
Added Entry:State University of New York at Binghamton