Effect of a protective enclosure on the acoustical response of a MEMS directional microphone

مرکز و کتابخانه مطالعات اسلامی به زبان های اروپایی

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" Effect of a protective enclosure on the acoustical response of a MEMS directional microphone "
Mihir Dhananjay Shetye R. N. Miles

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	54668
Doc. No	:	TL24622
Call number	:	‭3288774‬
Main Entry	:	Mihir Dhananjay Shetye
Title & Author	:	Effect of a protective enclosure on the acoustical response of a MEMS directional microphone\ Mihir Dhananjay Shetye
College	:	State University of New York at Binghamton
Date	:	2007
Degree	:	Ph.D.
student score	:	2007
Page No	:	193
Abstract	:	A novel differential microphone design has been proposed by Miles et al. based on the ears of the fly Ormia ochracea . An important aspect of the overall package design for this microphone is the design of a cover to protect the microphone diaphragm from the effects of dust and other foreign particles. The cover is placed on top of the microphone chip. Screens are attached on top of the cover. Screens can have an effect on the acoustic response of the system and hence need to be accounted for. In the analysis presented, two cover and screen assemblies are used for the two halves of the differential microphone. The response of this assembly to sound is studied using an acoustical transfer matrix model. The response of the differential microphone with this protective enclosure is also measured and this is compared to the predictions. Another important part of this effort is to characterize the acoustical properties of the screen materials. To study the effect of the porous screen on sound transmission, it is necessary to characterize the material using two basic parameters: the complex acoustic propagation constant and the complex impedance. A setup is developed for the insertion loss measurement, which is then used to predict the impedance. An optimized differential microphone design is also proposed. The stress due to the fabrication process induces out-of-plane displacement in the microphone diaphragm. This displacement can cause the diaphragm to hit into the back-plate. Hence design changes are introduced to ensure a relatively stress-free skin. Optimization routines are also run to minimize the mechanical-thermal noise of the microphone.
Subject	:	Applied sciences; Protective enclosure; Acoustical; MEMS; Microphone; Mechanical engineering; 0548:Mechanical engineering
Added Entry	:	R. N. Miles
Added Entry	:	State University of New York at Binghamton