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Document Type:Latin Dissertation
Language of Document:English
Record Number:55754
Doc. No:TL25708
Call number:‭1456520‬
Main Entry:Denisse E. Yepez
Title & Author:Analysis of a mechanical punching process to create registration holes on a continuous Roll-to-Roll flexible electronics substrates using SPC techniquesDenisse E. Yepez
College:State University of New York at Binghamton
Date:2008
Degree:M.S.
student score:2008
Page No:135
Abstract:Roll-to-Roll (R2R) offers the potential to create large area, continuous flexible electronics applications. Unlike current generation flexible electronics (where a single rigid frame is used); the continuous R2R substrate uses a clear plastic material, which does not lend itself for registration within the processing equipment particularly the photolithography. Failure of the processing equipment to locate the substrate can cause misalignment problems that can lead to circuit discontinuity and other defects. Hence, for substrate registration, holes are punched along one edge of the substrate prior to processing. Three parameters that are crucial and need to be within specifications are: hole diameter, center-to-edge and center-to-center distances. The objective of this research endeavor is to analyze and attempt to improve the mechanical hole-punching process, using Statistical Process Control (SPC) techniques. Essentially, this research reports the process capability indices (PCIs) of the punching process and suggests alternative avenues to creating holes for substrate registration.
Subject:Applied sciences; Industrial engineering; 0546:Industrial engineering
Added Entry:D. L. Santos
Added Entry:State University of New York at Binghamton