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" Mechanics and materials for electronic packaging : "
co-sponsored by the Applied Mechanics Division, ASME ... [et al.].
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BL
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| Record Number
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568417
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| Doc. No
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b397636
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| Title & Author
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Mechanics and materials for electronic packaging : : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /\ co-sponsored by the Applied Mechanics Division, ASME ... [et al.].
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| Publication Statement
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New York, N.Y. :: American Society of Mechanical Engineers,, c1994.
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| Series Statement
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AMD ;; vol. 187, 193, 195
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| Page. NO
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3 v. :: ill. ;; 28 cm.
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| ISBN
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0791814491
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: 0791814270
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: 0791814424
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| Bibliographies/Indexes
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Includes bibliographical references and index.
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| Contents
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v. 1. Design and process issues in electronic packaging / edited by William T. Chen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.
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| Subject
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Electronic packaging-- Congresses.
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Chen, William T.
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Schen, Michael A.
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Dunn, M. L., (Martin L)
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International Mechanical Engineering Congress and Exposition(1994 :, Chicago, Ill.)
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American Society of Mechanical Engineers., Applied Mechanics Division.
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