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" Components, packaging and manufacturing technology : "
edited by Yanwen Wu.
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BL
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| Record Number
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568654
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| Doc. No
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b397873
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| Main Entry
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International Conference on Components, Packaging and Manufacturing Technology(2010 :, Sanya Shi, China)
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| Title & Author
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Components, packaging and manufacturing technology : : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 /\ edited by Yanwen Wu.
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| Publication Statement
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Stafa-Zurich, Switzerland :: Trans Tech,, c2011.
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| Series Statement
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Key engineering materials,; v. 460-461
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| Page. NO
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xvi, 852 p. :: ill. ;; 25 cm.
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| ISBN
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9780878492138
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0878492135
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| Bibliographies/Indexes
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Includes bibliographical references and indexes.
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| Subject
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Electronic apparatus and appliances, Congresses.
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Electronic packaging, Congresses.
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Microelectronic packaging, Congresses.
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| Subject
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Manufacturing processes, Congresses.
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| Added Entry
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Wu, Yanwen.
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| Parallel Title
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ICCPMT 2010
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