| Document Type
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BL
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| Record Number
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572583
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| Doc. No
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b401802
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| Main Entry
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Xiao, Hong.
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| Title & Author
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Introduction to semiconductor manufacturing technology\ Hong Xiao.
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| Edition Statement
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2nd ed.
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| Publication Statement
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Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) :: SPIE,, 2012.
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| Series Statement
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SPIE Press monograph ;; PM220
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| Page. NO
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1 online resource (xix, 656 p.) :: ill., digital file.
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| ISBN
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9780819490933
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: 0819490938
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9780819490926
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| Notes
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"SPIE Digital Library."--Website.
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| Contents
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Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary.
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| Abstract
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Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technolgies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations.
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| Subject
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Integrated circuits-- Design and construction.
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| Subject
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Semiconductors-- Design and construction.
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| Subject
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Semiconductor industry.
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| Added Entry
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Society of Photo-optical Instrumentation Engineers.
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