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" Advances in CMP/polishing technologies for the manufacture of electronic devices "


Document Type : BL
Record Number : 573030
Doc. No : b402249
Title & Author : Advances in CMP/polishing technologies for the manufacture of electronic devices\ edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
Publication Statement : Oxford ;New York :: Elsevier,, c2012.
ISBN : 9781437778595
: : 1437778593
Bibliographies/Indexes : Includes bibliographical references and index.
Abstract : CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
Subject : Grinding and polishing.
Subject : Chemical mechanical planarization.
Subject : Electrolytic polishing.
Added Entry : Doi, Toshiro K.,1947-
: Marinescu, Ioan D.
: Kurokawa, Syuhei.
Added Entry : ScienceDirect (Online service).
Parallel Title : CMP polishing technologies for the manufacture of electronic devices
copyhttps://lib.clisel.com/site/catalogue/573030
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