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" Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® "
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
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BL
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| Record Number
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573884
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b403103
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| Main Entry
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Madenci, Erdogan.
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| Title & Author
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®\ by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
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| Publication Statement
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Boston, MA :: Springer US :: Imprint: Springer,, 2003.
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| Series Statement
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Springer International Series in Engineering and Computer Science,; 719
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| ISBN
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9781461502555
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: 9781461349891
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| Abstract
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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
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Engineering.
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Machinery.
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Computer engineering.
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Optical materials.
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Guven, Ibrahim.
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Kilic, Bahattin.
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SpringerLink (Online service)
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