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" Manufacturing Challenges in Electronic Packaging "
by Y. C. Lee, W. T. Chen.
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BL
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| Record Number
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574194
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b403413
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| Main Entry
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Lee, Y. C.
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| Title & Author
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Manufacturing Challenges in Electronic Packaging\ by Y. C. Lee, W. T. Chen.
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| Publication Statement
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Boston, MA :: Springer US :: Imprint: Springer,, 1998.
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| ISBN
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9781461558033
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: 9781461376590
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| Abstract
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This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
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Engineering.
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Machinery.
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Chen, W. T.
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SpringerLink (Online service)
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