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" Failure Modes and Mechanisms in Electronic Packages "
by Puligandla Viswanadham, Pratap Singh.
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BL
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| Record Number
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574206
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b403425
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| Main Entry
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Viswanadham, Puligandla.
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| Title & Author
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Failure Modes and Mechanisms in Electronic Packages\ by Puligandla Viswanadham, Pratap Singh.
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| Publication Statement
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Boston, MA :: Springer US :: Imprint: Springer,, 1998.
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| ISBN
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9781461560296
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: 9781461377634
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| Abstract
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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.
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Engineering.
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Microprogramming.
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Machinery.
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Computer engineering.
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Systems engineering.
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Singh, Pratap.
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SpringerLink (Online service)
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