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" Lead-free solder interconnect reliability "


Document Type : BL
Record Number : 607379
Doc. No : dltt
Title & Author : Lead-free solder interconnect reliability\ edited by Dongkai Shangguan.
Publication Statement : Materials Park, OH :: ASM International,, 2005.
Page. NO : 1 online resource (x, 292 p.) :: ill.
ISBN : 9781615030934 (electronic bk.)
: : 161503093X (electronic bk.)
: 9780871708168
: 0871708167
Bibliographies/Indexes : Includes bibliographical references and index.
Subject : Microelectronic packaging-- Reliability.
Subject : Solder and soldering.
Subject : Lead-free electronics manufacturing processes.
Dewey Classification : ‭621.381/046‬
LC Classification : ‭TK7870.15‬‭.L425 2005eb‬
Added Entry : Shangguan, Dongkai,1963-
Added Entry : Knovel (Firm)
copyhttps://lib.clisel.com/site/catalogue/607379
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