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" Modeling and simulation for microelectronic packaging assembly "
Sheng Liu, Yong Liu.
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BL
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| Record Number
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619206
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dltt
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| Main Entry
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Liu, S., (Sheng),1963-
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| Title & Author
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Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /\ Sheng Liu, Yong Liu.
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| Publication Statement
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[Beijing] :: Chemical Industry Press ;Singapore :: Wiley,, 2011.
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| ISBN
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9780470827802
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: 0470827807
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| Bibliographies/Indexes
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Includes bibliographical references and index.
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| Abstract
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"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| Subject
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Microelectronic packaging-- Simulation methods.
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| NLM classification
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TEC008010bisacsh
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| Added Entry
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Liu, Yong, (Micro-optoelectronic mechanical systems professor)
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Wiley Online Library (Online service)
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