| Document Type | : | BL | 
                
                    | Record Number | : | 662570 | 
                
                    | Doc. No | : | dltt | 
                
                    | Title & Author | : | Future trends in microelectronics.\  edited by Serge Luryi, Jimmy Xu, Alexander Zaslavsky | 
                
                    | Page. NO | : | 1 online resource | 
                
                    | ISBN | : | 9781119069171 | 
                
                    |  | : | : 1119069173 | 
                
                    |  | : | 9781119069188 | 
                
                    |  | : | 1119069181 | 
                
                    |  | : | 9781119069119      (cloth) | 
                
                    |  | : | : 9781119069225 | 
                
                    |  | : | : 111906922X | 
                
                    | Bibliographies/Indexes | : | Includes bibliographical references and index | 
                
                    | Contents | : | Cover ; Title Page ; Copyright ; Contents ; List of Contributors ; Preface ; Acknowledgments ; Part I Future of Digital Silicon; 1.1 Prospects of Future Si Technologies in the Data-Driven World; 1. Introduction ; 2. Memory -- DRAM ; 3. Memory -- NAND ; 4. Logic technology ; 5. CMOS image sensors ; 6. Packaging technology | 
                
                    |  | : | 7. Silicon photonics technology 8. Concluding remarks ; Acknowledgments ; References ; 1.2 How Lithography Enables Moore's Law; 1. Introduction ; 2. Moore's Law and the contribution of lithography ; 3. Lithography technology: past and present ; 4. Lithography technology: future ; 5. Summary | 
                
                    |  | : | 6. Conclusion Acknowledgments ; References ; 1.3 What Happened to Post-CMOS?; 1. Introduction ; 2. General constraints on speed and energy ; 3. Guidelines for success ; 4. Benchmarking and examples ; 5. Discussion ; 6. Conclusion ; Acknowledgments ; References | 
                
                    |  | : | 1.4 Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices1. Introduction ; 2. FEOL technology and materials for 3D integration ; 3. Integration of ""more than Moore"" functionality ; 4. Implications of 3D integration at the system level ; 5. Conclusion ; Acknowledgments ; References | 
                
                    |  | : | 1.5 Challenges to Ultralow-Power Semiconductor Device Operation1. Introduction ; 2. Ultimate MOS transistors ; 3. Small slope switches ; 4. Conclusion ; Acknowledgments ; References ; 1.6 A Universal Nonvolatile Processing Environment; 1. Introduction ; 2. Universal nonvolatile processing environment | 
                
                    | Subject | : | Microelectronics-- Technological innovations. | 
                
                    | Subject | : | Nanotechnology-- Technological innovations. | 
                
                    | Subject | : | Semiconductors-- Technological innovations. | 
                
                    | Dewey Classification | : | 621.381 | 
                
                    | LC Classification | : | TK7874 | 
                
                    | Added Entry | : | Luryi, Serge | 
                
                    |  | : | Xu, Jimmy | 
                
                    |  | : | Zaslavsky, Alex,1963- | 
                
                    | Added Entry | : | Ohio Library and Information Network. |