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" Electromigration in thin films and electronic devices : "
edited by Choong-Un Kim
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BL
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| Record Number
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693130
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| Doc. No
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b515319
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| Title & Author
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Electromigration in thin films and electronic devices : : materials and reliability /\ edited by Choong-Un Kim
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| Publication Statement
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Oxford ;Philadelphia :: Woodhead Publishing,, c2011
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| Series Statement
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Woodhead Publishing in materials
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| Page. NO
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xiii, 340 p. :: ill. ;; 25 cm
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| ISBN
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1845699378
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: 9781845699376
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| Bibliographies/Indexes
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Includes bibliographical references and index
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| Contents
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Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht
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| Subject
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Electrodiffusion
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Integrated circuits-- Deterioration
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Interconnects (Integrated circuit technology)
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| Subject
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Thin films
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| LC Classification
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TK7874.E478 2011
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| Added Entry
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Kim, Choong-Un
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