|
" Handbook of printed circuit manufacturing. "
Raymond H Clark
| Document Type
|
:
|
BL
|
| Record Number
|
:
|
732426
|
| Doc. No
|
:
|
b552214
|
| Main Entry
|
:
|
Raymond H Clark
|
| Title & Author
|
:
|
Handbook of printed circuit manufacturing.\ Raymond H Clark
|
| Publication Statement
|
:
|
[Place of publication not identified]: Springer, 2013
|
| ISBN
|
:
|
9401170126
|
|
|
:
|
: 9789401170123
|
| Contents
|
:
|
Section 1. Design and Manufacture of Printed Circuits.- 1. How Printed Circuit Boards Are Manufactured: Processes and Materials.- What Is a Printed Circuit Board?.- What Is the Dielectric Substrate Made Of?.- The Manufacturing Process.- Bare Board Electrical Testing.- Dielectric Substrates.- 2. Computer Aided Design and Design Automation.- Using CAD.- Comparing Design Automation to CAD.- 3. Digital Printed Circuit Design.- Definitions.- Section 2. Planning, Document Control, and Quality.- 4. Definitions.- 5. Planning.- Planning Responsibilities.- Planning Procedures: Refer to Copy of Traveler.- Planning Order of Priority.- New Revisions.- Reorders.- 6. Quality Assurance Program.- Dealing with Customers and Product Returned by the Customer.- Underwriters Laboratories (UL).- Military Certification.- Summary.- 7. Quality Assurance Manual.- Elements of Quality Assurance 91 Calibration Program.- Inspection Stamp Control.- Inspection Supervisor Duties.- First Article Inspection.- Inspection Procedures.- First Inspection.- Final Inspection Procedure.- Processing Non-Conforming Product.- Processing Re-Works.- Military Specification Printed Circuits.- Processing of Returned Product.- Section 3. Imaging and Artwork.- 8. Artwork Processing.- Exposing.- Developing.- Definitions.- Customer Artwork Inspection.- Copy to Make Copies.- Step and Repeat (Using Diazo Containing Silver Film).- Soldermask.- Multilayer.- Repeats.- Spreads and Chokes.- Photo Supervisor.- 9. Artwork Registration Systems for Dry Film Imaging.- Pin Registration.- Visual Registration.- The Horning Pin Registration Method.- 10. Dry Film Imaging.- Micro-Etchants.- Compatibility With Other Processes.- Dry Film Lamination.- Exposure.- Cleanliness.- The Phototool.- Exposure.- Developing.- Solvent Developing Photoresist.- Spray Nozzles.- Solvent, Distillation, Reclamation, and Storage.- Fully Aqueous Resist 215 Special Considerations.- 11. Screen Printing.- Screen Printing Versus Dry Film Imaging.- What Is Screen Printing?.- Basic Components of a Screen Printing Operation.- Frames and Screen Materials.- Cleaning New Screens.- Ultraviolet Exposure Source.- Exposure Control.- Stencil and Screen Preparation.- Set-Up for Screen Printing.- Stripping the Screen After Use.- Automatic Screen Printers.- Plating Resists.- Soldermask.- Legend Resists.- Section 4. N/C Processing.- 12. Numerical Controlled Drilling and Routing.- Design Considerations.- Artwork Generation.- Artwork Inspection.- Drilling.- Numerically Controlled Routing Parameters.- References.- Acknowledgments.- 12A. Drilling Procedures.- Section 5. Plating and Other Wet Processes.- 13. Metal Thickness Determination.- Copper.- Tin-Lead.- Nickel, Tin-Nickel, Tin, and Silver.- Gold.- 14. Amperage Determination.- Geography of the Plating Pattern.- Bath Chemistry 292 Temperature.- Agitation.- Other Considerations.- Determining Amperage.- Method 1.- Method 2.- Method 3.- Notes.- 15. The Electroless Copper Process 300 Detecting Problems.- Drying Is Required.- The Need for Scrubbing.- Dwell Time in Copper.- Neutralize Caustic Residue.- Analyze Regularly.- Air Supply Required.- Think About the Board Being Processed.- Flash with Electroplated Copper.- Use Pump Agitation on Catalyst.- Keeping Fingerprints Off Panel Surface.- Rework Through Electroless Copper.- Troubleshooting Electroless Copper.- Analytical Information.- Procedures.- Maintenance Information.- How the Process Works.- 16. Pattern Plating: Copper, Tin-Lead, and Other Metals.- Daily Operating Routine.- Other Considerations.- 17. Contact Finger Plating.- Automatic Contact Finger Plating 367 Manual Contact Finger Plating.- Chemical Considerations.- Plating Tank Considerations for Contact Finger Plating.- Appearance of the Gold Deposit 381 Appearance of the Nickel Deposit.- Amperage Determination for Contact Finger Plating.- Contact Finger Plating Procedures.- 18. Resist Stripping.- Screen Printed Resists.- Photoresist.- Disposing of Spent Stripper.- 19. Etching.- The Challenges of Etching Today.- General Etching Procedures.- 20. Tin-Lead Fusing.- Hot Oil Reflow.- Problems.- Section 6. Multilayer Printed Circuits.- 21. Multilayer Processing.- General Processing Steps.- Planning the Construction of a Multilayer Printed Circuit.- Processing Operations.- Other Considerations.- 22. Etchback and Smear Removal.- Techniques for Etchback and Smear Removal.- Chromic Acid.- Sulfuric Acid.- Plasma.- Other Etchback Considerations.- Section 7. Process Control.- 23. The Laboratory.- Uses of the Laboratory.- Analytical Procedures.- Micro-Sectioning.- Setting Up Your Own In-House Laboratory.- Documentation.- Section 8. The Marketing Program.- 24. Sales Tools.- The Company Brochure and Advertisements.- The Product Line.- Certifications.- Personnel.- The Facility.- Suggested List of Sales Tools.- 25. What Sales People Should Know About Printed Circuits.- Processing and Materials.- Blueprint Reading and Difficulty Factors.- Mil-Spec Printed Circuits.- Bare Board Testing.- Appendix A: Yield Tracking: A Tool for Productivity.- Appendix B: CAD: Swift, Precise, Infinitely Repeatable, but Never Creative.- Appendix C: Soldermask Over Bare Copper: Alternatives and Manufacturing Techniques.- Appendix D: Control and Operation of Printed Circuit Plating Baths with the Hull Cell.- Appendix E: Troubleshooting the IR Fusing Process.- Appendix F: Preserving Solderability with Solder Coatings.- Appendix G: Screen Printing Is the Answer.- Appendix H: Forecasting Waste Treatment Requirements.- Appendix I: Wave Soldering of Discrete Chip Components.
|
| LC Classification
|
:
|
TK7868.P7R396 2013
|
| Added Entry
|
:
|
Raymond H Clark
|
| |