| Document Type
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BL
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| Record Number
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733143
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| Doc. No
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b552938
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| Main Entry
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Gerald L. Ginsberg.
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| Title & Author
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Electronic equipment packaging technology\ Gerald L. Ginsberg.
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| Publication Statement
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New York: Van Nostrand Reinhold, ©1992.
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| Page. NO
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vii, 279 pages : illustrations ; 24 cm
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| ISBN
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0442238185
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: 9780442238186
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| Contents
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1 Packaging Implementation.- 1.1 Related General Packaging Issues.- 1.2 Levels of Packaging.- 1.3 Design Implementation Team.- 1.4 Product Applications.- 1.5 Packaging Priorities.- References.- 2 Integrated Circuits.- 2.1 Process Technology.- 2.2 Application-Specific Integrated Circuits.- References.- 3 Circuit Component Packages.- 3.1 Electronic Circuit Components.- 3.2 Electromechanical Circuit Components.- 3.3 Mechanical Circuit Component Hardware.- References.- 4 Multiple Bare Die Packaging Technologies.- 4.1 Bare-Die Termination Techniques.- 4.2 Hybrid Microcircuits.- 4.3 Chip-on-Board Technology.- 4.4 Multichip Modules.- References.- 5 Packaged Component Subassemblies.- 5.1 Electrical Performance.- 5.2 Packaging and Interconnecting (P&I) Structures.- 5.3 General Assembly Selection Considerations.- 5.4 Through-hole Technology.- 5.5 Surface Mount Technology (SMT).- References.- 6 Subassembly Interconnection Systems.- 6.1 Backplane Structures.- 6.2 Backplane Connectors.- 6.3 Discrete Solderless-wrap Backplane Wiring.- References.- 7 Wiring and Cabling Assemblies.- 7.1 Electrical Characteristics.- 7.2 Wire and Cable Materials.- 7.3 Wire and Cable Configurations.- 7.4 Cabling Connectors.- 7.5 Wire Terminations.- References.- 8 Electronic Equipment Enclosures.- 8.1 General Enclosure Selection Considerations.- 8.2 Cabinets.- 8.3 Small Equipment Enclosures.- 8.4 Portable Carrying Cases.- 8.5 Printed Board Enclosures.- References.- 9 Thermal Management.- 9.1 Basic Thermal Management Considerations.- 9.2 General Thermal Analysis.- 9.3 Heat Sinks.- 9.4 Air Movers (Fans and Blowers.- 9.5 Liquid Cooling.- 9.6 Thermoelectric Heat Pump Modules.- References.- 10 End Product Applications.- 10.1 Consumer Electronics.- 10.2 Data Processing Equipment (Computers).- 10.3 Aircraft (Avionics) Equipment.- 10.4 Military Shipboard Electronics.- 10.5 Biomedical Electronics.- References.
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| Subject
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Electronic equipment -- Packaging
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| Subject
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Electronic packaging.
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| LC Classification
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TK7870.15G473 1992
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| Added Entry
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Gerald L Ginsberg
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