| Document Type
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BL
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| Record Number
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800281
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| Doc. No
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b620342
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| Main Entry
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John H. Lau [and others].
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| Title & Author
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Advanced MEMS packaging\ John H. Lau [and others].
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| Publication Statement
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New York: McGraw-Hill, ©2010.
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| Series Statement
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McGraw-Hill's AccessEngineering
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| Page. NO
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(xxiii, 552 pages) : illustrations
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| ISBN
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0071626239
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: 0071627928
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: 0071741836
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: 1615831592
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: 9780071626231
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: 9780071627924
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: 9780071741835
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: 9781615831593
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| Contents
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Introduction to MEMS --; Advanced MEMS packaging --; Enabling technologies for advanced MEMS packaging --; Advanced MEMS wafer-level packaging --; Optical MEMS packaging : communications --; Optical MEMS packaging : bubble switch --; Optical MEMS : microbolometer packaging --; Bio-MEMS packaging --; Biosensor packaging --; Accelerometer packaging --; Radiofrequency MEMS switches --; RF MEMS tunable capacitors and tubable band-pass filters --; Advanced packaging of RF MEMS devices.
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| Abstract
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Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices. --
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| Subject
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Microelectromechanical systems.
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| Subject
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Microelectronic packaging.
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| Subject
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TECHNOLOGY ENGINEERING -- Electronics -- Microelectronics.
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| LC Classification
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TK7875.J646 2010
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| Added Entry
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John H Lau
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| Parallel Title
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Advanced microelectromechanical systems packaging
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