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" Integrity Issues & Simulation of Microelectronic Power Distribution Network "
Sharmin Islam
Elshabini, Aicha
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Latin Dissertation
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| Language of Document
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English
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| Record Number
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804158
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| Doc. No
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TL48975
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| Call number
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1831570254; 10149250
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| Main Entry
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Ferreira, Silvia C.
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| Title & Author
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Integrity Issues Simulation of Microelectronic Power Distribution Network\ Sharmin IslamElshabini, Aicha
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| College
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University of Idaho
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| Date
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2016
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| Degree
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M.S.
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| field of study
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Electrical and Computer Engineering
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| student score
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2016
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| Page No
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121
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| Note
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Committee members: Barlow, Fred; Guizani, Mohsen; Li, Feng
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| Note
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Place of publication: United States, Ann Arbor; ISBN=978-1-369-04368-6
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| Abstract
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High speed, high densities and system-in-packages play an important role in microelectronics. Taking advantage of process technology improvements, semiconductor vendors are increasing device densities which increases demand on total current delivery. In this case, electrical integrity which includes signal integrity, power integrity and electromagnetic interference, is a major issue. Signal integrity assures acceptable quality of signals within the system, such as transmission line effects, cross talk, impedance mismatch. Power integrity assures acceptable quality of power delivery within the system, such as voltage drop, high impedance, parasitic via inductances, noise coupling are the most significant challenges for a semiconductor device designer. The increasingly rigorous noise requirements and timing issues require more predictive signal integrity and power integrity analysis to meet the market demand.
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| Subject
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Electrical engineering
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| Descriptor
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Applied sciences;Ansys HFSS;Differential S parameters;Power distribution network (PDN);Power integrity;Signal integrity;Z parameters
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| Added Entry
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Elshabini, Aicha
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Electrical and Computer EngineeringUniversity of Idaho
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