| Document Type
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BL
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| Record Number
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854235
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| Main Entry
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Sturdivant, Rick
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| Title & Author
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Microwave and millimeter-wave electronic packaging /\ Rick Sturdivant.
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| Publication Statement
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Boston [Massachusetts] ;London [England] :: Artech House,, 2014.
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, ©2014
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| Series Statement
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Artech House Microwave Library
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| Page. NO
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1 online resource (281 pages) :: illustrations
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| ISBN
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1523117427
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: 1608076970
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: 1608076989
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: 9781523117420
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: 9781608076970
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: 9781608076987
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9781608076970
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| Bibliographies/Indexes
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Includes bibliographical references at the end of each chapters and index.
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| Contents
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Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons.
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| Abstract
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Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
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| Subject
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Microelectronic packaging.
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| Subject
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Microelectronic packaging.
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| Subject
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TECHNOLOGY ENGINEERING-- Mechanical.
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| Dewey Classification
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621.381046
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| LC Classification
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TK7870.15.S787 2014eb
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