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BL
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| Record Number
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890229
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| Main Entry
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Lau, John H.
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| Title & Author
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Heterogeneous integrations /\ John H. Lau.
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| Publication Statement
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Singapore :: Springer,, 2019.
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| Page. NO
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1 online resource (xxii, 368 pages) :: illustrations (some color)
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| ISBN
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9789811372247
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: 9811372241
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9789811372230
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9811372233
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| Bibliographies/Indexes
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Includes bibliographical references and index.
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| Contents
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Intro; Preface; Acknowledgements; Contents; About the Author; 1 Overview of Heterogeneous Integrations; 1.1 Introduction; 1.2 Multichip Module (MCM); 1.2.1 MCM-C; 1.2.2 MCM-D; 1.2.3 MCM-L; 1.3 System-in-Package (SiP); 1.3.1 Intention of SiP; 1.3.2 Actual Applications of SiP; 1.3.3 Potential Applications of SiP; 1.4 System-on-Chip (SoC); 1.4.1 Apple Application Processor (A10); 1.4.2 Apple Application Processor (A11); 1.4.3 Apple Application Processor (A12); 1.5 Heterogeneous Integration; 1.5.1 Heterogeneous Integration Versus SoC; 1.5.2 Advantages of Heterogeneous Integration
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1.10.1 STATSChipPAC's FOFC-eWLB1.10.2 ASE's FOCoS; 1.10.3 MediaTek's RDLs by FOWLP; 1.10.4 Samsung's Si-Less RDL Interposer; 1.10.5 TSMC's InFO_oS; 1.11 Heterogeneous Integration of AiP and Baseband Chipset; 1.11.1 TSMC's AiP with FOWLP; 1.11.2 Heterogeneous Integration of AiP and Baseband Chipset; 1.12 Heterogeneous Integration of PoP; 1.12.1 Amkor/Qualcomm/Shinko's PoP; 1.12.2 Apple/TSMC's PoP for AP A10; 1.12.3 Samsung's PoP for Smartwatch; 1.13 Heterogeneous Integration of Memory Stacks; 1.13.1 Heterogeneous Integration of Memory Chips by Wire Bonding
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1.13.2 Heterogeneous Integration of Memory Chips by Low Temperature Bonding1.14 Heterogeneous Integration of Chip-to-Chip Stacks; 1.14.1 Intel's Modem Chipset for iPhone XR; 1.14.2 IME's Chip-to-Chip Stack with TSVs; 1.14.3 IME's Chip-to-Chip Stack Without TSV; 1.15 Heterogeneous Integration of CIS; 1.15.1 Heterogeneous Integration of Sony's CIS; 1.15.2 Heterogeneous Integration of STMicroelectronics' CIS; 1.16 Heterogeneous Integration of LED; 1.16.1 Heterogeneous Integration of HKUST's LED; 1.16.2 Heterogeneous Integration of JCAP's LED; 1.17 Heterogeneous Integration of MEMS
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1.6 Heterogeneous Integration on Organic Substrates1.6.1 Amkor's SiP for Automobiles; 1.6.2 Apple Watch III (SiP) Assembled by ASE; 1.6.3 Cisco's ASIC and HBM on Organic Substrate; 1.6.4 Intel's CPU and Micron's HMC on Organic Substrate; 1.7 Heterogeneous Integration on Silicon Substrates (TSV-Interposer); 1.7.1 Leti's SoW; 1.7.2 IME's SoW; 1.7.3 ITRI's Heterogeneous Integrations; 1.7.4 Xilinx/TSMC's CoWoS; 1.7.5 TSV/RDL Interposer with Chips on Both Sides; 1.7.6 Interposer with Double-Sided Chip Attachments; 1.7.7 AMD's GPU and Hynix's HBM on TSV-Interposer
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1.7.8 NVidia's GPU and Samsung's HBM2 on TSV-Interposer1.7.9 IME's MEMS Based Tunable Laser Source on Si-Substrate; 1.7.10 UCSB/AMD's Chiplets on TSV-Interposers; 1.8 Heterogeneous Integration on Silicon Substrates (Bridges); 1.8.1 Intel's EMIB for Heterogeneous Integration; 1.8.2 Imec's Bridges for Heterogeneous Integrations; 1.8.3 ITRI's Bridge for Heterogeneous Integrations; 1.9 FOW/PLP for Heterogeneous Integrations; 1.9.1 FOWLP for Heterogeneous Integrations; 1.9.2 FOPLP for Heterogeneous Integrations; 1.10 Heterogeneous Integrations on Fan-Out RDL Substrates
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| Abstract
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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
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| Subject
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Integrated circuits.
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| Subject
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Integrated circuits.
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| Dewey Classification
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621.39/5
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| LC Classification
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TK7874
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