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BL
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| Record Number
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890372
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| Main Entry
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Karmakar, Ayan
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| Title & Author
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Si-RF technology /\ Ayan Karmakar, Kamaljeet Singh.
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| Publication Statement
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Singapore :: Springer,, [2019]
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| Page. NO
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1 online resource (157 pages)
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| ISBN
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9789811380518
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: 9789811380525
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: 9789811380532
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: 9811380511
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: 981138052X
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: 9811380538
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9789811380501
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9811380503
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| Contents
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Intro; Foreword; Preface; Acknowledgements; Contents; About the Authors; Abbreviations; 1 Silicon Implementation of Planar Topologies; 1.1 Microstrip and CPW Topologies; 1.2 Losses in Planar Topologies; 1.3 Substrate Selection; 1.4 Silicon Substrate and Associated Challenges; 1.5 Modeling Aspects; 1.6 Loss Compensation Techniques; 1.7 Summarization; References; 2 Fabrication Technologies; 2.1 Bulk and Surface Micromachining; 2.2 Wafer Bonding; 2.2.1 Anodic Bonding; 2.2.2 Eutectic Bonding; 2.3 Summarization; References; 3 Passive Circuits; 3.1 Planar Balun (Single-Band Topology)
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3.1.1 Design Aspects3.1.2 Electromagnetic Analysis and Layout; 3.1.3 Effect of Substrate Resistivity; 3.1.4 Fabrication and Measured Results; 3.2 Power Divider (Multiband Topologies); 3.2.1 Dual-Band Power Divider; 3.2.2 Receiver Concept (Multiband Topology); 3.3 CPW-Microstrip Transition; 3.4 Summarization; References; 4 Planar Antenna; 4.1 Ultra-Wideband Topology; 4.1.1 Antenna Design; 4.1.2 Fabrication and Measured Results; 4.1.3 Time-Domain Analysis of the Proposed Monopole Antenna; 4.2 Micromachined Patch Antenna and Array Topology; 4.2.1 Antenna Design
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4.2.2 Fabrication and Measured Results4.3 Summary; 4.4 MATLAB Program for Calculations of Patch Length and Width with Given Dimensions; References; 5 MEMS Switch; 5.1 Background; 5.2 RF-Switch Development; 5.2.1 Electrical Modeling; 5.2.2 Fabrication Process; 5.2.3 Test and Characterization; 5.3 Switched-Line Phase Shifter; 5.3.1 Bit Design; 5.3.2 CLR Model of Single-Bit Phase Shifter; 5.3.3 EM Simulation of the Individual Bit; 5.3.4 Fabricated Prototype; 5.3.5 Proposed Testing Methodology of Phase Shifter; 5.4 MATLAB Program; 5.5 Summary; References; 6 Packaging Concept in Radio Frequency
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6.1 Standard RF Package Configuration6.2 Package Simulation; 6.2.1 Eigen-Mode Simulation; 6.2.2 Loss Characterization; 6.3 Proposed Modification; 6.4 Characterization; 6.5 Through-Silicon Via (TSV); 6.5.1 Modeling; 6.5.2 Process Establishment; 6.6 MATLAB Code; 6.7 Summary; References; Future Scope; Appendix A; Material Properties of Some Useful Metals and Dielectrics; Appendix B; Relaxation Time Estimation for Some Materials Used in RF/Microwave Applications; Appendix C; Tentative Etch Rate of Various Thin Films of in Wet and Dry Methods; Appendix D
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Readymade Chart for VSWR, Return Loss, and Reflection CoefficientAppendix E; Frequently used Equipments and Test Components in RF Domain
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| Abstract
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This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
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| Subject
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Radio frequency integrated circuits.
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| Subject
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Radio frequency integrated circuits.
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| Dewey Classification
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621.38412
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621.39/5
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| LC Classification
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TK7874.78.K37 2019
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| Added Entry
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Singh, Kamaljeet
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| Parallel Title
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Silicon radio frequency technology
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